Pass condition
Grade:60 Fraction
  • 2025課程說明-彰師大
  • 主題 2024 封測產業未來展望 -蔡瀛洲 20241115 v2 彰師
  • 電子構裝流程(一)-20240220改 CH
  • 電子構裝流程(二)-DS-202503-王聖元.江明徽
  • 電子構裝流程(五)-更新版-CH-彰師大
  • 期中考_武林秘笈-彰師
  • 電子構裝流程(三)-DB
  • 電子構裝流程(七)-FV
  • 電子構裝流程_RDL Bumping
  • 新技術應用材料介紹
  • 封測材料介紹(一)_202504
  • Thermal Mechanical Simulation Introduction V3-0515
  • 彰師大學分班期末考_武林秘笈
Instructor
林祐仲
Recommended Courses
  • 1082-Semiconductor Sufaces and Interfaces-26003
    Period:2020-02-01~2020-07-31
    LINE sharing feature only supports mobile devices
  • 1061-Special Topics on Material of Solid State Physics I-23070
    Period:2017-09-01~2018-01-31
    LINE sharing feature only supports mobile devices
  • 1022-Electronics II-23057
    Period:2014-02-01~2014-08-31
    LINE sharing feature only supports mobile devices
  • 1011-Experiments of Electronics II-23043
    Period:2012-09-10~2013-01-31
    LINE sharing feature only supports mobile devices
  • 992-Seminar(II)-26035
    Period:2011-02-07~2011-07-31
    LINE sharing feature only supports mobile devices


LINE sharing feature only supports mobile devices