通過條件
成 績 :60 分
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Lecture 1 : Introduction
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Lecture 2 : Cleanroom and wafer cleaning
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Lecture 3 : Crystal growth and Epitaxy
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Lecture 4 : Photolithography (Part I)
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PR data sheet : AZ 5214E
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PR data sheet : DUV PR
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Lecture 4: Photolithograpy (Part II)
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Lecture 4 : Photolithography Future trend
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Lecture 5 : Oxidation and Thermal Process
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Lecture 6 : Etch Basics and Wet Etch
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Lecture 6 Reference - HF MSDS
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Lecture 6 Reference - How to read MSDS and chemical labels
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Lecture 8 : Plasma and Dry etching (Part I)
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Lecture 8 : Dry Etching (part II)
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Lecture 9 : Diffusion and Ion implantation (part I)
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Lecture 9 : Ion implantation (part II)
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Lecture 9 : Impantation safty and future trend
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Lectrue 10 : CVD (part I)
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Lecture 10 : CVD (part II)
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Lecture 10 : Future trend
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Lecture 11 : Metallization (part I)
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Lecture 11 : Metallization (part II)
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Lecture 7 : Vacuum system
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Lecture 12 : Process integration
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Lecture 12 : CMOS after 2010
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Lecture 12 : Copper interconnection
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