1011-電子封裝-51023

報名期間：從 即日起 到 無限期
上課期間：從 2012-09-10 到 2013-01-31

• 教學大綱
• 參考書籍 Eric Bogatin, Roadmaps of Packaging Technology,
• W01~W02 IntroRoadMap
• W03 Driving_Force
• W04 Thermal Management
• W05 Electrical Performance
• W06 EVOLUTIONARY ADVANCES
• W07 Chip Bonding
• W08_BGA_CSP
• W08_MATLAB
• ** Midterm Reminder
• W9_MIDTERM_SOLUTIONS
• W10_Interconnect
• W11_MCM
• W12_ATD
• W13 Group Discussion Assignment
• W14 MEMS PackagingEx1
• W15 MEMS PackagingEx2
• W15 MIL-STD-883F
• W16 Decision Game
• W18 Final_Project
• W18 Final_Project_TEST REPORT V1
• W18 Final Project - Syringe Pressure Characterization
• Sowtware_pc-wizard (電腦測試軟體)
• Assignment1
• Assignment2
• REF0A Characterization of MEMS Pressure Sensor
• REF01 Wafer Level Vacuum Packaging of MEMS Sensors
• REF02 Wafer level vacuum packaging
• REF03 Wafer-level 3D
• REF04 Electrical Design of a High Speed Computer Packaging System
• REF05 MEMS封裝
• MATLAB
• SciLAB
• SciLAB RAR
• SCORE(總成績)