1011-Electronic Encapsulation-51023

Registration：Now ~ Any Time
Course Period：2012-09-10 ~ 2013-01-31

• W01~W02 IntroRoadMap
• W03 Driving_Force
• W06 EVOLUTIONARY ADVANCES
• W07 Chip Bonding
• W08_BGA_CSP
• W08_MATLAB
• ** Midterm Reminder
• W10_Interconnect
• W11_MCM
• W12_ATD
• W14 MEMS PackagingEx1
• W15 MEMS PackagingEx2
• W15 MIL-STD-883F
• W16 Decision Game
• W18 Final_Project
• W18 Final_Project_TEST REPORT V1
• Sowtware_pc-wizard (電腦測試軟體)
• Assignment1
• Assignment2
• REF0A Characterization of MEMS Pressure Sensor
• REF01 Wafer Level Vacuum Packaging of MEMS Sensors
• REF02 Wafer level vacuum packaging
• REF03 Wafer-level 3D
• REF04 Electrical Design of a High Speed Computer Packaging System
• REF05 MEMS封裝
• SciLAB RAR